Quick answer: Dicing Quartz Glass Wafers covers Quartz Glass (CTE 0.59 x 10^-6 /K, 260 nm – 2.5 um); Dicing to +/-0.01 mm index accuracy. Prototypes ship in 5-10 working days.
The combination of Quartz Glass and Dicing comes up constantly in RFQs for a reason – the material offers plasma and halogen resistance, and Dicing is the right way to get accurate geometry into it. Expect +/-0.01 mm index accuracy and edge chipping under 15 um.
The numbers
| Material | Quartz Glass (GE214-equivalent, semiconductor grade) |
|---|---|
| Thermal expansion (CTE) | 0.59 x 10^-6 /K |
| Service temperature | 1,050 C continuous |
| Transmission range | 260 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.459 @ 587 nm |
| Stock thickness | 0.20 – 60 mm |
| Maximum blank size | 450 mm diameter |
| Process | Dicing |
| Working tolerance | +/-0.01 mm index accuracy |
| Minimum feature | 30 um kerf |
| Surface finish | edge chipping under 15 um |
| Thickness window | 0.05 – 3 mm |
| Edge condition | saw edge, optional etch relief |
| Wafer formats | 2", 3", 4", 6", 8" and 12" with SEMI flats or notch |
| TTV | under 3 – 5 um by format |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
DFM notes from the shop floor
Three items decide most of the cost and lead time on this work:
- Material note: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
- Process boundary: straight-line cuts only; contours route to laser cutting instead.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Process window
Dicing earns its place through singulating wafers into dies with tight index accuracy and low chipping. Its boundary condition – straight-line cuts only; contours route to laser cutting instead – is the first thing our DFM review checks.
Beyond this page, Quartz Glass routinely runs through drilling, etching, edge grinding, cnc machining in our shop – most real parts combine two or three of these steps.
Typical applications
The recurring buyers of dicing quartz glass wafers: semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: ScienceDirect: quartz glass.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: ultra-thin glass materials, ultra-thin quartz discs, glass wafer coring.
Buyer questions, answered
What equipment runs the dicing work?
Automatic dicing saws with resin and metal-bond blades.
Is there a minimum order for dicing quartz glass wafers?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
Specifications on this page were last reviewed by our engineering team in September 2026.