Process Capability

Drilling Borofloat 33

Drilling Borofloat 33: Borofloat 33, CTE 3.25 x 10^-6 /K; +/-0.02 mm hole position. No MOQ, prototypes in 5-10 days, DFM review with every RFQ.

Drilling Borofloat 33

Quick answer: Drilling Borofloat 33 covers Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); Drilling to +/-0.02 mm hole position. Prototypes ship in 5-10 working days.

Ask any process engineer what makes borofloat 33 difficult and the answer is specific: float tin side must be tracked when parts see coating or bonding steps. Our drilling line is tooled around exactly that – diamond core drills, ultrasonic assist and laser percussion heads – holding +/-0.02 mm hole position on parts from 0.1 – 30 mm thick.

Specification envelope

Material Borofloat 33 (SCHOTT float production, wafer grade)
Thermal expansion (CTE) 3.25 x 10^-6 /K
Service temperature 450 C continuous
Transmission range 350 nm – 2.0 um
Density 2.23 g/cm3
Knoop hardness 480 kg/mm2
Refractive index 1.471 @ 587 nm
Stock thickness 0.70 – 25.4 mm
Maximum blank size 500 x 500 mm
Process Drilling
Working tolerance +/-0.02 mm hole position
Minimum feature 0.15 mm laser / 0.5 mm mechanical
Surface finish exit-chip controlled below 0.1 mm
Thickness window 0.1 – 30 mm
Edge condition optional chamfered hole entry
RFQ inputs PDF/DXF/STEP drawing, quantity brackets, surface and edge spec

Process window

Drilling earns its place through through-holes, blind holes and countersinks at densities beyond 1,000 holes per part. Its boundary condition – hole-to-edge distance should stay above 1.5x thickness to protect strength – is the first thing our DFM review checks.

Beyond this page, Borofloat 33 routinely runs through dicing, polishing, coring, edge grinding in our shop – most real parts combine two or three of these steps.

DFM notes from the shop floor

Three items decide most of the cost and lead time on this work:

  • Material note: float tin side must be tracked when parts see coating or bonding steps.
  • Process boundary: hole-to-edge distance should stay above 1.5x thickness to protect strength.
  • Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.

The full rules live in our tolerance design guide and holes and edges design guide.

Who orders this

The recurring buyers of drilling borofloat 33: optical sensors (sensor windows, filter caps, lens covers); led packaging (groove covers, phosphor carriers, package windows); mems devices (cap wafers, TGV substrates, motion-sensor lids). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.

Dimensions still moving? Configure this part live in the 3D builder below, or open the full custom glass machining 3D builder to start from a blank canvas.

For adjacent specifications, see precision glass drilling, Borofloat 33 selection guide, surface quality guide.

Frequently asked questions

What tolerances are achievable on Borofloat 33 parts?

Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Float tin side must be tracked when parts see coating or bonding steps.

What thickness range do you stock for Borofloat 33?

Standard stock spans 0.70 – 25.4 mm, with blanks up to 500 x 500 mm. Other formats are sourced per order.

How does Borofloat 33 behave under heat?

CTE is 3.25 x 10^-6 /K and continuous service reaches 450 C continuous, which is what drives its use where float-glass flatness off the line matters.

What accuracy does drilling hold?

+/-0.02 mm hole position with minimum features of 0.15 mm laser / 0.5 mm mechanical. Hole-to-edge distance should stay above 1.5x thickness to protect strength.

Specifications on this page were last reviewed by our engineering team in July 2026.

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Engineering Review

Have a drawing for this process?

Upload it with your RFQ - engineering replies with a DFM note and firm lead time.

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