Quick answer: Edge Grinding Quartz Glass covers Quartz Glass (CTE 0.59 x 10^-6 /K, 260 nm – 2.5 um); Edge Grinding to chamfer +/-0.05 mm. Prototypes ship in 5-10 working days.
The combination of Quartz Glass and Edge Grinding comes up constantly in RFQs for a reason – the material offers plasma and halogen resistance, and Edge Grinding is the right way to get accurate geometry into it. Expect chamfer +/-0.05 mm and ground C or R profile, polish option.
The numbers
| Material | Quartz Glass (GE214-equivalent, semiconductor grade) |
|---|---|
| Thermal expansion (CTE) | 0.59 x 10^-6 /K |
| Service temperature | 1,050 C continuous |
| Transmission range | 260 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.459 @ 587 nm |
| Stock thickness | 0.20 – 60 mm |
| Maximum blank size | 450 mm diameter |
| Process | Edge Grinding |
| Working tolerance | chamfer +/-0.05 mm |
| Minimum feature | 0.1 mm chamfer leg |
| Surface finish | ground C or R profile, polish option |
| Thickness window | 0.1 – 25 mm |
| Edge condition | C-chamfer, R-round, pencil or OG profile |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
DFM notes from the shop floor
The shop-floor rules that matter here:
- Material note: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
- Process boundary: profiles below 0.1 mm leg length are lapped by hand and priced per edge.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Manufacturing capability
The core strength of Edge Grinding is edge strength – a finished chamfer roughly doubles the bend strength of a cut edge. The honest limit: profiles below 0.1 mm leg length are lapped by hand and priced per edge. Both belong on the drawing before quoting, not after.
One material, many routes: on Quartz Glass we also quote ultrasonic machining, lapping, cnc machining, dicing, and multi-step drawings are the norm rather than the exception.
Application context
edge grinding quartz glass shows up across semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: ScienceDirect: quartz glass.
Dimensions still moving? Configure this part live in the 3D builder below, or open the full custom glass machining 3D builder to start from a blank canvas.
For adjacent specifications, see perforated quartz plates, JGS1 quartz glass, 4 inch Borofloat wafers.
Frequently asked questions
What tolerances are achievable on Quartz Glass parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
What thickness range do you stock for Quartz Glass?
Standard stock spans 0.20 – 60 mm, with blanks up to 450 mm diameter. Other formats are sourced per order.
How does Quartz Glass behave under heat?
CTE is 0.59 x 10^-6 /K and continuous service reaches 1,050 C continuous, which is what drives its use where fused from natural quartz crystal matters.
What accuracy does edge grinding hold?
Chamfer +/-0.05 mm with minimum features of 0.1 mm chamfer leg. Profiles below 0.1 mm leg length are lapped by hand and priced per edge.
What equipment runs the edge grinding work?
CNC edge grinders with profiled diamond wheels.
Specifications on this page were last reviewed by our engineering team in July 2026.