Etching D263 Thin Glass – D263 Thin Glass (CTE 7.2 x 10^-6 /K, 350 nm – 2.0 um); Etching to depth control +/-1 um. No minimum order; DFM review included with every RFQ.
Ask any process engineer what makes d263 thin glass difficult and the answer is specific: ultra-thin stock cannot take conventional clamping; parts are machined on wax or UV-tape carriers. Our etching line is tooled around exactly that – buffered HF wet benches and masked lithography line – holding depth control +/-1 um on parts from 0.1 – 5 mm thick.
Specification envelope
| Material | D263 Thin Glass (SCHOTT D 263 T eco) |
|---|---|
| Thermal expansion (CTE) | 7.2 x 10^-6 /K |
| Service temperature | 400 C (Tg 557 C) |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.51 g/cm3 |
| Knoop hardness | 590 kg/mm2 |
| Refractive index | 1.523 @ 587 nm |
| Stock thickness | 0.03 – 1.1 mm |
| Maximum blank size | 440 x 360 mm |
| Process | Etching |
| Working tolerance | depth control +/-1 um |
| Minimum feature | 10 um channel width (masked HF) |
| Surface finish | isotropic smooth walls |
| Thickness window | 0.1 – 5 mm |
| Edge condition | stress-relief etch available |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
What the process holds
Etching earns its place through microchannels, cavities and frosted textures without mechanical stress. Its boundary condition – isotropic undercut roughly equals depth, so masks are compensated at layout time – is the first thing our DFM review checks.
Beyond this page, D263 Thin Glass routinely runs through grinding, double-side polishing, cnc machining, dicing in our shop – most real parts combine two or three of these steps.
Design guidance
The shop-floor rules that matter here:
- Material note: ultra-thin stock cannot take conventional clamping; parts are machined on wax or UV-tape carriers.
- Process boundary: isotropic undercut roughly equals depth, so masks are compensated at layout time.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Who orders this
etching d263 thin glass shows up across oled packaging (cover lids, frit-seal frames, fill-port plates); led packaging (groove covers, phosphor carriers, package windows); medical diagnostics (flow cells, slides, microplate bottoms, cuvette windows). Background reading on the underlying material science: SCHOTT D 263 thin glass.
Dimensions still moving? Configure this part live in the 3D builder below, or open the full custom glass machining 3D builder to start from a blank canvas.
Useful companion pages: BF33 microfluidic chip, AR coating process, fused silica material guide.
Common questions
What tolerances are achievable on D263 Thin Glass parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Ultra-thin stock cannot take conventional clamping; parts are machined on wax or UV-tape carriers.
What thickness range do you stock for D263 Thin Glass?
Standard stock spans 0.03 – 1.1 mm, with blanks up to 440 x 360 mm. Other formats are sourced per order.
How does D263 Thin Glass behave under heat?
CTE is 7.2 x 10^-6 /K and continuous service reaches 400 C (Tg 557 C), which is what drives its use where down-drawn fire-polished surfaces matters.
What accuracy does etching hold?
Depth control +/-1 um with minimum features of 10 um channel width (masked HF). Isotropic undercut roughly equals depth, so masks are compensated at layout time.
Specifications on this page were last reviewed by our engineering team in July 2026.