Etching D263 Thin Glass – D263 Thin Glass (CTE 7.2 x 10^-6 /K, 350 nm – 2.0 um); Etching to depth control +/-1 um. No minimum order; DFM review included with every RFQ.
Ask any process engineer what makes d263 thin glass difficult and the answer is specific: ultra-thin stock cannot take conventional clamping; parts are machined on wax or UV-tape carriers. Our etching line is tooled around exactly that – buffered HF wet benches and masked lithography line – holding depth control +/-1 um on parts from 0.1 – 5 mm thick.
Specification envelope
| Material | D263 Thin Glass (SCHOTT D 263 T eco) |
|---|---|
| Thermal expansion (CTE) | 7.2 x 10^-6 /K |
| Service temperature | 400 C (Tg 557 C) |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.51 g/cm3 |
| Knoop hardness | 590 kg/mm2 |
| Refractive index | 1.523 @ 587 nm |
| Stock thickness | 0.03 – 1.1 mm |
| Maximum blank size | 440 x 360 mm |
| Process | Etching |
| Working tolerance | depth control +/-1 um |
| Minimum feature | 10 um channel width (masked HF) |
| Surface finish | isotropic smooth walls |
| Thickness window | 0.1 – 5 mm |
| Edge condition | stress-relief etch available |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
What the process holds
Etching earns its place through microchannels, cavities and frosted textures without mechanical stress. Its boundary condition – isotropic undercut roughly equals depth, so masks are compensated at layout time – is the first thing our DFM review checks.
Beyond this page, D263 Thin Glass routinely runs through cnc machining, polishing, dicing, edge grinding in our shop – most real parts combine two or three of these steps.
Design guidance
Three items decide most of the cost and lead time on this work:
- Material note: ultra-thin stock cannot take conventional clamping; parts are machined on wax or UV-tape carriers.
- Process boundary: isotropic undercut roughly equals depth, so masks are compensated at layout time.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Who orders this
Orders for etching d263 thin glass cluster in oled packaging (cover lids, frit-seal frames, fill-port plates); microfluidic devices (chips, manifolds, via plates, bonded stacks); medical diagnostics (flow cells, slides, microplate bottoms, cuvette windows). Background reading on the underlying material science: SCHOTT D 263 thin glass.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: laser glass cutting, high-purity quartz guide, fused silica wafer applications.
Common questions
What equipment runs the etching work?
Buffered HF wet benches and masked lithography line.
Is there a minimum order for etching d263 thin glass?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Specifications on this page were last reviewed by our engineering team in September 2026.