Fused Silica for CCD Inspection Equipment: Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um). Single-piece prototypes to production volumes, quoted from your drawing.
fused silica for ccd inspection equipment programs need large-format screening plates with sub-micron cleanliness. Fused Silica is the fit here because it offers near-zero thermal expansion. Typical parts: CCD cover plates, reference grids, stage glass.
Specifications at a glance
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Manufacturing capability
One material, many routes: on Fused Silica we also quote grinding, edge grinding, lapping, laser cutting, and multi-step drawings are the norm rather than the exception.
Design guidance
Three items decide most of the cost and lead time on this work:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Where these parts end up
The recurring buyers of fused silica for ccd inspection equipment: microfluidic devices (chips, manifolds, via plates, bonded stacks); optical sensors (sensor windows, filter caps, lens covers); ccd inspection equipment (CCD cover plates, reference grids, stage glass). Background reading on the underlying material science: RP Photonics: fused silica.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: fused silica wafer applications, wafer dicing process, 4 inch Borofloat wafers.
Buyer questions, answered
How does Fused Silica behave under heat?
CTE is 0.55 x 10^-6 /K and continuous service reaches 1,100 C continuous, which is what drives its use where near-zero thermal expansion matters.
What do ccd inspection equipment programs usually order?
CCD cover plates, reference grids, stage glass. Typical spec: particle spec Class 100 packing, flatness 5 um.
Is there a minimum order for fused silica for ccd inspection equipment?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
Specifications on this page were last reviewed by our engineering team in August 2026.