Fused Silica for Laser Systems: Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um). Single-piece prototypes to production volumes, quoted from your drawing.
What fused silica for laser systems actually buys from a glass shop: windows, beam splitters, debris shields. The requirement underneath is high damage-threshold optics with certified surfaces. Fused Silica is the fit here because it offers near-zero thermal expansion.
Key parameters
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
DFM notes from the shop floor
The shop-floor rules that matter here:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Manufacturing capability
One material, many routes: on Fused Silica we also quote edge grinding, lapping, cnc machining, dicing, and multi-step drawings are the norm rather than the exception.
Where these parts end up
The recurring buyers of fused silica for laser systems: semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); medical diagnostics (flow cells, slides, microplate bottoms, cuvette windows); scientific instruments (reference flats, cells, prism mounts, stage inserts). Background reading on the underlying material science: RP Photonics: fused silica.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
For adjacent specifications, see fused silica wafer applications, fused silica wafers 2-12 inch, machining tolerance guide.
Frequently asked questions
How does Fused Silica behave under heat?
CTE is 0.55 x 10^-6 /K and continuous service reaches 1,100 C continuous, which is what drives its use where near-zero thermal expansion matters.
What do laser systems programs usually order?
Windows, beam splitters, debris shields. Typical spec: scratch-dig 20/10, LIDT to 10 J/cm2 @ 1064 nm.
Is there a minimum order for fused silica for laser systems?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
Specifications on this page were last reviewed by our engineering team in August 2026.