Laser Cutting Borofloat 33 – Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); Laser Cutting to +/-0.02 mm contour. No minimum order; DFM review included with every RFQ.
laser cutting borofloat 33 is a materials problem before it is a machining problem. Borofloat 33 has float-glass flatness off the line and a Knoop hardness of 480 kg/mm2, so the laser cutting recipe – feeds, coolant, tooling – differs from what works on ordinary float glass. The line runs picosecond and CO2 laser stations with vision registration and holds +/-0.02 mm contour.
Key parameters
| Material | Borofloat 33 (SCHOTT float production, wafer grade) |
|---|---|
| Thermal expansion (CTE) | 3.25 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.471 @ 587 nm |
| Stock thickness | 0.70 – 25.4 mm |
| Maximum blank size | 500 x 500 mm |
| Process | Laser Cutting |
| Working tolerance | +/-0.02 mm contour |
| Minimum feature | 0.10 mm hole diameter |
| Surface finish | sealed edge, chip-free |
| Thickness window | 0.03 – 6 mm |
| Edge condition | filamentation edge, optional post-polish |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Getting the drawing right
Three items decide most of the cost and lead time on this work:
- Material note: float tin side must be tracked when parts see coating or bonding steps.
- Process boundary: aspect ratio in a single pass tops out near 10:1; thicker sections shift to coring or ultrasonic work.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
What the process holds
Laser Cutting earns its place through chip-free free-form contours and dense hole arrays in thin and ultra-thin glass. Its boundary condition – aspect ratio in a single pass tops out near 10:1; thicker sections shift to coring or ultrasonic work – is the first thing our DFM review checks.
Beyond this page, Borofloat 33 routinely runs through polishing, cnc machining, edge grinding, double-side polishing in our shop – most real parts combine two or three of these steps.
Typical applications
Orders for laser cutting borofloat 33 cluster in optical sensors (sensor windows, filter caps, lens covers); machine vision (camera windows, ring-light diffusers, calibration plates); microfluidic devices (chips, manifolds, via plates, bonded stacks). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.
The fastest route to a quote is geometry: use the 3D configurator below, or the site-wide custom glass machining 3D builder for fully custom parts.
Related reading on this site: 4 inch Borofloat wafers, wafer dicing process, high-purity quartz guide.
Common questions
What tolerances are achievable on Borofloat 33 parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Float tin side must be tracked when parts see coating or bonding steps.
What thickness range do you stock for Borofloat 33?
Standard stock spans 0.70 – 25.4 mm, with blanks up to 500 x 500 mm. Other formats are sourced per order.
How does Borofloat 33 behave under heat?
CTE is 3.25 x 10^-6 /K and continuous service reaches 450 C continuous, which is what drives its use where float-glass flatness off the line matters.
What accuracy does laser cutting hold?
+/-0.02 mm contour with minimum features of 0.10 mm hole diameter. Aspect ratio in a single pass tops out near 10:1; thicker sections shift to coring or ultrasonic work.
What equipment runs the laser cutting work?
Picosecond and CO2 laser stations with vision registration.
Specifications on this page were last reviewed by our engineering team in July 2026.