Metallization Borofloat 33: Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); films 50 nm – 2 um, patterned to 10 um lines. Single-piece prototypes to production volumes, quoted from your drawing.
metallization borofloat 33 is Cr/Au, Ti/Pt or Al thin films applied by sputter + lift-off or shadow mask. On Borofloat 33 it solderable pads, mirrors and electrodes on glass – the specification we run to is films 50 nm – 2 um, patterned to 10 um lines.
Key parameters
| Material | Borofloat 33 (SCHOTT float production, wafer grade) |
|---|---|
| Thermal expansion (CTE) | 3.25 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.471 @ 587 nm |
| Stock thickness | 0.70 – 25.4 mm |
| Maximum blank size | 500 x 500 mm |
| Treatment | Metallization – Cr/Au, Ti/Pt or Al thin films |
| Specification | films 50 nm – 2 um, patterned to 10 um lines |
| Deposition / method | sputter + lift-off or shadow mask |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Design guidance
Before sending the RFQ, check these against your drawing:
- Material note: float tin side must be tracked when parts see coating or bonding steps.
- Sequence matters: all machining happens before metallization; post-coating rework is not economical.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
What the process holds
Beyond this page, Borofloat 33 routinely runs through sandblasting, grinding, ultrasonic machining, dicing in our shop – most real parts combine two or three of these steps.
Typical applications
metallization borofloat 33 shows up across microfluidic devices (chips, manifolds, via plates, bonded stacks); mems devices (cap wafers, TGV substrates, motion-sensor lids); machine vision (camera windows, ring-light diffusers, calibration plates). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Related reading on this site: Borofloat 33 selection guide, wafer dicing process, glass sandblasting.
Frequently asked questions
Is there a minimum order for metallization borofloat 33?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Borofloat 33 parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Float tin side must be tracked when parts see coating or bonding steps.
Specifications on this page were last reviewed by our engineering team in September 2026.