Process Capability

Polishing D263 Thin Glass

Polishing D263 Thin Glass: D263 Thin Glass, CTE 7.2 x 10^-6 /K; flatness to lambda/4 per 25 mm. No MOQ, prototypes in 5-10 days, DFM review with every RFQ.

Polishing D263 Thin Glass

Polishing D263 Thin Glass: D263 Thin Glass (CTE 7.2 x 10^-6 /K, 350 nm – 2.0 um); Polishing to flatness to lambda/4 per 25 mm. Single-piece prototypes to production volumes, quoted from your drawing.

Ask any process engineer what makes d263 thin glass difficult and the answer is specific: ultra-thin stock cannot take conventional clamping; parts are machined on wax or UV-tape carriers. Our polishing line is tooled around exactly that – pitch and polyurethane pad polishers with cerium oxide slurry – holding flatness to lambda/4 per 25 mm on parts from 0.2 – 50 mm thick.

Specification envelope

Material D263 Thin Glass (SCHOTT D 263 T eco)
Thermal expansion (CTE) 7.2 x 10^-6 /K
Service temperature 400 C (Tg 557 C)
Transmission range 350 nm – 2.0 um
Density 2.51 g/cm3
Knoop hardness 590 kg/mm2
Refractive index 1.523 @ 587 nm
Stock thickness 0.03 – 1.1 mm
Maximum blank size 440 x 360 mm
Process Polishing
Working tolerance flatness to lambda/4 per 25 mm
Minimum feature Ra below 1 nm
Surface finish scratch-dig 40/20 to 20/10
Thickness window 0.2 – 50 mm
Edge condition polished bevels available
RFQ inputs PDF/DXF/STEP drawing, quantity brackets, surface and edge spec

Capabilities and limits

The core strength of Polishing is optical-grade faces with certified scratch-dig and interferometer-verified flatness. The honest limit: steep aspect parts and deep pockets polish unevenly; those faces are specified as fine-ground. Both belong on the drawing before quoting, not after.

One material, many routes: on D263 Thin Glass we also quote edge grinding, dicing, etching, and multi-step drawings are the norm rather than the exception.

Design guidance

Before sending the RFQ, check these against your drawing:

  • Material note: ultra-thin stock cannot take conventional clamping; parts are machined on wax or UV-tape carriers.
  • Process boundary: steep aspect parts and deep pockets polish unevenly; those faces are specified as fine-ground.
  • Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.

The full rules live in our tolerance design guide and holes and edges design guide.

Who orders this

The recurring buyers of polishing d263 thin glass: oled packaging (cover lids, frit-seal frames, fill-port plates); led packaging (groove covers, phosphor carriers, package windows); medical diagnostics (flow cells, slides, microplate bottoms, cuvette windows). Background reading on the underlying material science: SCHOTT D 263 thin glass.

Dimensions still moving? Configure this part live in the 3D builder below, or open the full custom glass machining 3D builder to start from a blank canvas.

Useful companion pages: optical polishing capability, glass wafer coring, FTO conductive glass.

Common questions

What tolerances are achievable on D263 Thin Glass parts?

Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Ultra-thin stock cannot take conventional clamping; parts are machined on wax or UV-tape carriers.

What thickness range do you stock for D263 Thin Glass?

Standard stock spans 0.03 – 1.1 mm, with blanks up to 440 x 360 mm. Other formats are sourced per order.

How does D263 Thin Glass behave under heat?

CTE is 7.2 x 10^-6 /K and continuous service reaches 400 C (Tg 557 C), which is what drives its use where down-drawn fire-polished surfaces matters.

What accuracy does polishing hold?

Flatness to lambda/4 per 25 mm with minimum features of Ra below 1 nm. Steep aspect parts and deep pockets polish unevenly; those faces are specified as fine-ground.

Specifications on this page were last reviewed by our engineering team in July 2026.

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