Product type: Quartz Plate. Application: Glass. Model: At-Cut 3\" (76.2mm).
Overview
The at-Cut 3" (76.2mm) Saw Grade Quartz Crystal Wafer Substrate with 0.35mm Thickness is supplied as a fused silica / quartz wafer made from Quartz Crystal. Listed geometry: diameter 25.4mm-200mm, thickness 0.10mm or More. It is used in Glass. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.
Specifications
| Material | Quartz Crystal |
|---|---|
| Type | Quartz Plate |
| Diameter | 25.4mm-200mm |
| Thickness | 0.10mm or More |
| Application | Glass |
| Model NO. | At-Cut 3\" (76.2mm) |
| Ttv | <2um |
| Warp | <20um |
| Bow | <10um |
| Surface Finish | Ssp/DSP |
| Cutting Angle | X/Y/Z/At32,33,36/Bt/St42.75deg;-Cut |
| Supplier | Hangzhou Freq-Control Electronic Technology Ltd. |
Technical data
| Material | Quartz Crystal | |||
| Cutting Angle | X/Y/Z/AT32,33,36/BT/ST42.75°-cut etc | |||
| Diameter/size | 3"(76.2mm) | 4" (100mm) | 6"(150mm) | 8"(200mm) |
| Tol(±) | <0.20 mm | |||
| Thinnest Thickness | 0.08mm Min | 0.10mm Min | 0.20mm Min | 0.35mm or more |
| Primary Flat | 22mm | 32mm | 42.5mm | 57.5mm |
| LTV (5mmx5mm) | <1µm | |||
| TTV | <3µm | |||
| Bow | -30<bow<30 | |||
| Warp | <40µm | |||
| PLTV(<0.5um) | ≥95%(5mm*5mm) | |||
| Orientation Flat | All available | |||
| Surface Type | Single Side Polished /Double Sides Polished | |||
| Polished side Ra | <0.5nm | |||
| Back Side Criteria | General is 0.2-0.5µm or as customized | |||
| Edge Criteria | R=0.2mm or Bullnose | |||
| Material Property | ECD | Better than grade 4 | ||
| Inclusion | Better than grade II | |||
| Q-Value | Better than grade C | |||
| Wafer Surface Criteria | Particles ¢>0.3 µ m | <= 30 | ||
| Scratch , Chipping | None | |||
| Defect | No edge cracks, scratches, saw marks, stains | |||
| Packaging | Qty/Wafer box | 25pcs per box |
What to specify when you request a quote
- Diameter and flat / notch — listed as “25.4mm-200mm”; state diameter, flat or notch and their tolerances.
- Thickness and TTV — listed as “0.10mm or More”; give thickness, its tolerance and total thickness variation.
- Polish and roughness — listed as “Ssp/DSP”; specify single- or double-side polish and roughness.
- Flatness, bow and warp — listed as “<20um”; quote flatness, bow and warp limits.
- Material grade — listed as “Quartz Crystal”; name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).
Engineering guides for this part
For material grades and coating options, see Fused Silica and Quartz Glass: Selecting Materials for Precision Components. How parts like this are machined and finished is covered in Glass Wafer Cutting for Thin Precision Substrates. For an application example, read Fused Silica Glass Wafers for Precision Appliance Electronics. Before sending a drawing, check Technical Guide to Glass Thickness and Flatness Requirements. A related standard product is Fused Silica Glass Wafers (2–12", JGS1/JGS2).
