SKU MG-1F6FCA

Customize Circular Clear Fused Silica Sheet Quartz Wafer with Laser Drilling Hole

Customize Circular Clear Fused Silica Sheet Quartz Wafer with Laser Drilling Hole — a fused silica / quartz wafer. Specs, RFQ checklist and custom sizes…

Quartz PlateType
40/60, 20/10Surface quality
Chemical, GlassApplication
HB-QPModel NO.
Customize Circular Clear Fused Silica Sheet Quartz Wafer with Laser Drilling Hole

Product type: Quartz Plate. Application: Chemical, Glass. Model: HB-QP.

Overview

The Customize Circular Clear Fused Silica Sheet Quartz Wafer with Laser Drilling Hole is supplied as a fused silica / quartz wafer. Surface quality 40/60, 20/10; temperature 1100 Degree. It is used in Chemical and Glass. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.

Specifications

Type Quartz Plate
Surface quality 40/60, 20/10
Application Chemical, Glass
Model NO. HB-QP
Purity 99.99%
Long Time Working Temperature 1100 Degree
Short Time Working Temperature 1200 Degree
Density 2.21g/cm3
Strain Point 1120 Degree
Softening Point 1680 Degree
Anneal Point 1180 Degree
Color Clear
Mohs Hardness 6
Poisson Ratio 0.17
Keyword1 Clear Quartz Wafer
Keyword2 Silica Quartz Sheet
Clear fused silica quartz sheet 1.Heat resistance
Supplier Lianyungang Highborn Technology Co., Ltd.

Technical data

Compressive Strength >1100Mpa Coefficient of thermal expansion 5.5×10-7cm/cm.°C
Bending Strength 67Mpa Hot work temperature 1750~2050°C
Tensile Strength 48.3Mpa The temperature for a short time 1250°C
Poisson's Ratio 0.14~0.17 The temperature for a long time 1100°C
Elastic Modulus 71700Mpa Resistivity 7×107Ω.cm
Shearing Modulus 31000Mpa Dielectric Strength 250~400Kv/cm
Moths Hardness 5.3~6.5(Moths Scale) Dielectric Constant 3.7~3.9
Deformation Point 1350°C Dielectric absorption coefficient <4×104
Specific Heat(20~350°C) 670J/kg °C Dielectric loss coefficient <1×104
Product clear silica quartz sheet
Purity 99.99%
working temperature 1100 degree
Uv transmission at 254nm above 85%
standard Size OD60
thickness 1mm/2mm/3mm
1. High-quality products 2. Optimal price 3.SafeTransportation
4. Sample service 5. Customized size 6. Compensate for broken goods
7. Safe package 8. Transportation safety 9. Low procurement risk

What to specify when you request a quote

  • Diameter and flat / notch — state diameter, flat or notch and their tolerances.
  • Thickness and TTV — give thickness, its tolerance and total thickness variation.
  • Polish and roughness — listed as “40/60, 20/10”; specify single- or double-side polish and roughness.
  • Flatness, bow and warp — quote flatness, bow and warp limits.
  • Material grade — name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).

Engineering guides for this part

For material grades and coating options, see Selecting Fused Silica and Quartz Glass for Precision Components. How parts like this are machined and finished is covered in Glass Wafer Cutting, Dicing, and Coring: Precision Manufacturing Process. For an application example, read Custom Perforated Quartz Plate for Appliance Airflow Sensors. Before sending a drawing, check Quartz Glass Manufacturing: Controlling Thermal Conductivity in Fused Silica. A related standard product is Fused Silica Glass Wafers (2–12", JGS1/JGS2).

FAQ

Where is this fused silica / quartz wafer used? expand_more
Listed applications: Chemical and Glass.
What should I include in a quote request? expand_more
Include diameter and flat / notch, thickness and ttv, polish and roughness, flatness, bow and warp and material grade, plus quantity and a drawing if the part is custom.
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FREQUENTLY ASKED QUESTIONS
Which fused silica grade should I choose — JGS1, JGS2 or JGS3?

JGS1 offers deep-UV transmission from about 185 nm (best for DUV lithography and UV laser optics). JGS2 transmits well from about 220 nm for standard UV-visible use at lower cost. JGS3 is optimized for visible-to-infrared and high-power laser work. The builder exposes a transmission-band requirement so you can specify the grade by application.

What wafer diameters and thicknesses are supported?

Common diameters are 2, 3, 4 and 6 inch (note 1 inch = 25.0 mm for quartz wafers, so a 4 inch wafer is 100 mm). Typical thicknesses are 200, 500, 700 and 1000 µm, with tighter thickness tolerance and TTV specifiable for polished optical grades.

Can I specify TTV, surface quality and a flat or notch?

Yes. You can set total thickness variation, scratch-dig surface quality (down to 40/20 or 20/10 for optical grade), single- or double-side polish, and a primary flat or notch for orientation.

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Customize Circular Clear Fused Silica Sheet Quartz Wafer with Laser Drilling Hole

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