Product type: Quartz Plate. Application: Rubber, Plastic, Chemical, Construction, Metallurgy, Ceramic, Casting, Glass, Semiconductor. Model: HB-QP.
Overview
The Customize Circular Transparent Fused Window Silica Wafer Clear Quartz Discs with Hole is supplied as a fused silica / quartz wafer. Temperature 1100 Degree. Typical applications: Rubber, Plastic, Chemical, Construction and Metallurgy. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.
Specifications
| Type | Quartz Plate |
|---|---|
| Application | Rubber, Plastic, Chemical, Construction, Metallurgy, Ceramic, Casting, Glass, Semiconductor |
| Model NO. | HB-QP |
| Purity | 99.99% |
| Long Time Working Temperature | 1100 Degree |
| Short Time Working Temperature | 1200degree |
| Density | 2.21g/cm3 |
| Strain Point | 1120 Degree |
| Softening Point | 1680 Degree |
| Anneal Point | 1180 Degree |
| Color | Clear |
| Mohs Hardness | 6 |
| Poisson Ratio | 0.17 |
| Keyword1 | Jgs1 Clear Quartz Discs |
| Keyword2 | Jgs2 Clear Quartz Window |
| ISO 9001 | 2015 and IATF 16949 |
| ISO9001 | 2015 Quality Management System |
| Period of validity | from2024.10.17 to 2027.10.25 |
| Date | MAY .08.2026 |
| Supplier | Lianyungang Highborn Technology Co., Ltd. |
Technical data
| Property Content | Property Index |
|---|---|
| Density | 2.21×103kg/cm3 |
| Tensile Strength | 4.8×107Pa (N/m2) |
| Compression Strength | >1.1×109Pa |
| Coefficient of Thermal Expansion | 5.5×10-7cm/cm℃ |
| Thermal Conductivity | 1.4W/m℃ |
| Specific Heat | 680J/kg℃ |
| Softening Point | 1700℃ |
| Annealing Point | 1210℃ |
What to specify when you request a quote
- Diameter and flat / notch — state diameter, flat or notch and their tolerances.
- Thickness and TTV — give thickness, its tolerance and total thickness variation.
- Polish and roughness — specify single- or double-side polish and roughness.
- Flatness, bow and warp — quote flatness, bow and warp limits.
- Material grade — name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).
Engineering guides for this part
For material grades and coating options, see Fused Silica and Quartz Glass: Selecting Materials for Precision Components. How parts like this are machined and finished is covered in Precision Glass Hole Machining for MEMS and Wafer Parts. For an application example, read Fused Silica Glass Wafers for Precision Appliance Electronics. Before sending a drawing, check Quartz Glass Manufacturing: Controlling Thermal Conductivity in Fused Silica. A related standard product is Fused Silica Glass Wafers (2–12", JGS1/JGS2).
