SKU MG-303ED9

Customized Polishing Laser Boring Clear Quartz Glass Lens Fused Silica Wafers

Customized Polishing Laser Boring Clear Quartz Glass Lens Fused Silica Wafers — a fused silica / quartz wafer. Specs, RFQ checklist and custom sizes to…

Quartz PlateType
RoundShape
5-1500mmSize
Can Be CustomizedDimension
Customized Polishing Laser Boring Clear Quartz Glass Lens Fused Silica Wafers

Product type: Quartz Plate. Application: Lens. Model: HB-QP.

Overview

The Customized Polishing Laser Boring Clear Quartz Glass Lens Fused Silica Wafers is supplied as a fused silica / quartz wafer. Listed geometry: size 5-1500mm, round shape. Surface quality Polishing; temperature 1100 Degree. Typical applications: Chemical, Construction, Metallurgy, Ceramic and Casting. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.

Specifications

Type Quartz Plate
Shape Round
Size 5-1500mm
Dimension Can Be Customized
Surface Quality Polishing
Application Chemical, Construction, Metallurgy, Ceramic, Casting, Glass, Well Drilling, Decorations, Heater, Printer
Usage Lens
Model NO. HB-QP
Color Transparent
Edge Can Be Flamed
Temperature 1100 Degree
Two Sides Polishing or Grind
Surface No Airline, No Bubbles
Sio2 > 99.99%
Density 2.21
Customized Support OEM
Key Word Quartz Lens
Main Appilication Used for window material,mask substrate or heat insulation,optics,electronics,medical treatment,laser industries ect.
Material properties of transparent quartz glass High Durability
Further process of clear quartz disk We can do edge flame polishing, optical polishing, grind, general polishing, two sides polishing, one side polishing and the other side grind.
Supplier Lianyungang Highborn Technology Co., Ltd.

Technical data

Al Fe Ca Mg Ti Cu Mn K Na Li Co Ni B
21.32 0.94 1.88 0.29 0.54 0.05 0.05 0.40 2.06 1.66 0.07 0.07 0.16
Purity Total Impurities, including Al, Fe, Ca, Mg, Ti, Cu, Ni,Co, Mn, k, Na, Li, B<35ppm<>
Thermal Data Annealing Point Strain Point Softening Point Melting Point Expansion Index
1120°C 1210°C 1570°C 1730°C 5.5×10-7/°C
Operation Temperature Short-term Long-term
1300°C 1100°C
Mechanical Data Rigidity Modulus 3.1×104Mpa Density 2.2/cm3 MohsHardness 6 Young`s Modulus 7.2×104Mpa Compression Strength 1.1×103Mpa Poisson Ratio 0.17 Elongation Strength 48Mpa
produce per customers' request such as design & package & printing logo Professional package to ensure the transportation with no goods damaged. The Trade Assurance Service is ready for you and our guarantee account is USD40000.
Sampling Service. After-sales service. Quick response, 100% feedback. OEM service.
15 years golden supplier. 0% compain feedback 100% good reputation.

What to specify when you request a quote

  • Diameter and flat / notch — listed as “5-1500mm”; state diameter, flat or notch and their tolerances.
  • Thickness and TTV — give thickness, its tolerance and total thickness variation.
  • Polish and roughness — listed as “Polishing”; specify single- or double-side polish and roughness.
  • Flatness, bow and warp — quote flatness, bow and warp limits.
  • Material grade — listed as “High Durability”; name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).

Engineering guides for this part

For material grades and coating options, see Selecting Fused Silica and Quartz Glass for Precision Components. How parts like this are machined and finished is covered in Custom Perforated Quartz Plate Processing: A Precision Manufacturing Guide. For an application example, read Fused Silica Glass Wafers for Precision Appliance Electronics. Before sending a drawing, check Quartz Glass Manufacturing: Controlling Thermal Conductivity in Fused Silica. A related standard product is Custom Perforated Quartz Plates.

FAQ

What sizes and thicknesses are available? expand_more
The listing gives size 5-1500mm. Custom outlines and thicknesses are made to drawing; state the tolerance you need.
Where is this fused silica / quartz wafer used? expand_more
Listed applications: Chemical, Construction, Metallurgy, Ceramic, Casting, Glass, Well Drilling and Decorations.
What should I include in a quote request? expand_more
Include diameter and flat / notch, thickness and ttv, polish and roughness, flatness, bow and warp and material grade, plus quantity and a drawing if the part is custom.
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FREQUENTLY ASKED QUESTIONS
Which fused silica grade should I choose — JGS1, JGS2 or JGS3?

JGS1 offers deep-UV transmission from about 185 nm (best for DUV lithography and UV laser optics). JGS2 transmits well from about 220 nm for standard UV-visible use at lower cost. JGS3 is optimized for visible-to-infrared and high-power laser work. The builder exposes a transmission-band requirement so you can specify the grade by application.

What wafer diameters and thicknesses are supported?

Common diameters are 2, 3, 4 and 6 inch (note 1 inch = 25.0 mm for quartz wafers, so a 4 inch wafer is 100 mm). Typical thicknesses are 200, 500, 700 and 1000 µm, with tighter thickness tolerance and TTV specifiable for polished optical grades.

Can I specify TTV, surface quality and a flat or notch?

Yes. You can set total thickness variation, scratch-dig surface quality (down to 40/20 or 20/10 for optical grade), single- or double-side polish, and a primary flat or notch for orientation.

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Customized Polishing Laser Boring Clear Quartz Glass Lens Fused Silica Wafers

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