Product type: Quartz Boat. Application: Rubber, Plastic, Chemical, Construction, Metallurgy, Ceramic, Casting, Glass, Semiconductor/Solar.
Overview
Quartz Boat Wafer Carrier with Precision Bending and Punching Services: a fused silica / quartz wafer. Temperature 1100 Degree. It is used in Rubber, Plastic, Chemical, Construction and Metallurgy. Dimensions, material grade, coating and finish can be quoted to your drawing; the values above are the listed starting point.
Specifications
| Type | Quartz Boat |
|---|---|
| Application | Rubber, Plastic, Chemical, Construction, Metallurgy, Ceramic, Casting, Glass, Semiconductor/Solar |
| Density | 2.2g/cm3 |
| Melt Point | 1750 Degree |
| Working Temperature | 1100 Degree |
| Sio2 | 99.99% |
| Annealing Point | 1210 Degree |
| Max Temperature Can Reach in a Short Tim | 1450 Degree |
| Heat Conductivity (W/M.K,1000℃ ) | 2.28 |
| Softening Point(℃) | 1250 Degree |
| Tailored Versatility | We cater to bespoke shapes and sizes, meticulously produced to meet your unique specifications. |
| Comprehensive Deep Processing | We offer services such as cutting, fire end processing, bending, and frosting to meet diverse requirements. |
| Welcoming Customization | We accommodate a wide array of lengths, diameters, thicknesses, or your custom drawings for bespoke solutions. |
| Non-Standard Instrument Customization | Offering professional, tailor-made customization with precise one-to-one drawing reproduction. |
| Applications | Our high-quality Quartz Boat Wafer Carrier is essential for diffusion and coating processes, |
| Packaging Details | Inner packing——-Our exquisite protective packing is specially designed for safeguarding quartz products, ensuring they arrive in perfect condition. |
| Supplier | JIANGSU HONGYANG QUARTZ PRODUCTS CO.,LTD. |
Technical data
| Compressive strength | >1100Mpa | Coefficient of thermal expansion | 5.5×10-7cm/cm. ºC |
| Bending Strength | 67Mpa | Melting temperature | 1750~1800ºC |
| Tensile Strength | 48.3Mpa | The temperature for a short time | 1500ºC |
| Poisson's Ratio | 0.14~0.17 | The temperature for a long time | 1200°ºC to 1300 ºC |
| Elastic Modulus | 71700Mpa | Resistivity | 7×107.2.cm |
| Shearing Modulus | 31000Mpa | Dielectric Strength | 250~400Kvicm |
| Moh's Hardness | 5.3~6.5(Moh's Scale) | Dielectric Constant | 3.7~3.9 |
| Deformation Point | 1650ºC | Dielectric absorption coefficient | <4×104 |
| Specific Heat(20~350°ºC) | 670J/kgºC | Dielectric loss coefficient | <1×104 |
| Thermai Conductivity | 1.4W/mºC | Typical Mechanical Property of Fused Quartz |
What to specify when you request a quote
- Diameter and flat / notch — state diameter, flat or notch and their tolerances.
- Thickness and TTV — give thickness, its tolerance and total thickness variation.
- Polish and roughness — specify single- or double-side polish and roughness.
- Flatness, bow and warp — quote flatness, bow and warp limits.
- Material grade — name the grade (JGS1/JGS2, Borofloat 33, alkali-free, sapphire orientation).
Engineering guides for this part
For material grades and coating options, see Selecting Fused Silica and Quartz Glass for Precision Components. How parts like this are machined and finished is covered in Precision CNC Machining of Quartz & Fused Silica Components. For an application example, read Fused Silica Glass Wafers for Precision Appliance Electronics. Before sending a drawing, check Quartz Glass Manufacturing: Controlling Thermal Conductivity in Fused Silica. A related standard product is Fused Silica Glass Wafers (2–12", JGS1/JGS2).
