Dicing D263 Thin Glass – D263 Thin Glass (CTE 7.2 x 10^-6 /K, 350 nm – 2.0 um); Dicing to +/-0.01 mm index accuracy. No minimum order; DFM review included with every RFQ.
Ask any process engineer what makes d263 thin glass difficult and the answer is specific: ultra-thin stock cannot take conventional clamping; parts are machined on wax or UV-tape carriers. Our dicing line is tooled around exactly that – automatic dicing saws with resin and metal-bond blades – holding +/-0.01 mm index accuracy on parts from 0.05 – 3 mm thick.
Specification envelope
| Material | D263 Thin Glass (SCHOTT D 263 T eco) |
|---|---|
| Thermal expansion (CTE) | 7.2 x 10^-6 /K |
| Service temperature | 400 C (Tg 557 C) |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.51 g/cm3 |
| Knoop hardness | 590 kg/mm2 |
| Refractive index | 1.523 @ 587 nm |
| Stock thickness | 0.03 – 1.1 mm |
| Maximum blank size | 440 x 360 mm |
| Process | Dicing |
| Working tolerance | +/-0.01 mm index accuracy |
| Minimum feature | 30 um kerf |
| Surface finish | edge chipping under 15 um |
| Thickness window | 0.05 – 3 mm |
| Edge condition | saw edge, optional etch relief |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Manufacturing capability
The core strength of Dicing is singulating wafers into dies with tight index accuracy and low chipping. The honest limit: straight-line cuts only; contours route to laser cutting instead. Both belong on the drawing before quoting, not after.
One material, many routes: on D263 Thin Glass we also quote double-side polishing, cnc machining, drilling, polishing, and multi-step drawings are the norm rather than the exception.
DFM notes from the shop floor
Three items decide most of the cost and lead time on this work:
- Material note: ultra-thin stock cannot take conventional clamping; parts are machined on wax or UV-tape carriers.
- Process boundary: straight-line cuts only; contours route to laser cutting instead.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Where these parts end up
The recurring buyers of dicing d263 thin glass: microfluidic devices (chips, manifolds, via plates, bonded stacks); oled packaging (cover lids, frit-seal frames, fill-port plates); led packaging (groove covers, phosphor carriers, package windows). Background reading on the underlying material science: SCHOTT D 263 thin glass.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: ultra-thin glass materials, wafer dicing process, optical polishing capability.
Common questions
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on D263 Thin Glass parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Ultra-thin stock cannot take conventional clamping; parts are machined on wax or UV-tape carriers.
Specifications on this page were last reviewed by our engineering team in September 2026.