Ultrasonic Machining Quartz Glass – Quartz Glass (CTE 0.59 x 10^-6 /K, 260 nm – 2.5 um); Ultrasonic Machining to +/-0.02 mm form. No minimum order; DFM review included with every RFQ.
Ask any process engineer what makes quartz glass difficult and the answer is specific: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt. Our ultrasonic machining line is tooled around exactly that – 20 kHz ultrasonic spindles with shaped diamond form tools – holding +/-0.02 mm form on parts from 0.5 – 25 mm thick.
Specification envelope
| Material | Quartz Glass (GE214-equivalent, semiconductor grade) |
|---|---|
| Thermal expansion (CTE) | 0.59 x 10^-6 /K |
| Service temperature | 1,050 C continuous |
| Transmission range | 260 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.459 @ 587 nm |
| Stock thickness | 0.20 – 60 mm |
| Maximum blank size | 450 mm diameter |
| Process | Ultrasonic Machining |
| Working tolerance | +/-0.02 mm form |
| Minimum feature | 0.3 mm blind features |
| Surface finish | matte machined surface |
| Thickness window | 0.5 – 25 mm |
| Edge condition | crack-free feature edges |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Process window
Ultrasonic Machining earns its place through blind cavities, non-round holes and stepped profiles that rotary tools cannot reach. Its boundary condition – material removal is slow, so it is reserved for features other processes cannot form – is the first thing our DFM review checks.
Beyond this page, Quartz Glass routinely runs through double-side polishing, laser cutting, edge grinding, grinding in our shop – most real parts combine two or three of these steps.
Design guidance
Before sending the RFQ, check these against your drawing:
- Material note: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
- Process boundary: material removal is slow, so it is reserved for features other processes cannot form.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Who orders this
Orders for ultrasonic machining quartz glass cluster in semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: ScienceDirect: quartz glass.
The fastest route to a quote is geometry: use the 3D configurator below, or the site-wide custom glass machining 3D builder for fully custom parts.
Related reading on this site: ultra-thin quartz discs, high-purity quartz guide, alkali-free glass wafers.
Common questions
What tolerances are achievable on Quartz Glass parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
What thickness range do you stock for Quartz Glass?
Standard stock spans 0.20 – 60 mm, with blanks up to 450 mm diameter. Other formats are sourced per order.
How does Quartz Glass behave under heat?
CTE is 0.59 x 10^-6 /K and continuous service reaches 1,050 C continuous, which is what drives its use where fused from natural quartz crystal matters.
What accuracy does ultrasonic machining hold?
+/-0.02 mm form with minimum features of 0.3 mm blind features. Material removal is slow, so it is reserved for features other processes cannot form.
Specifications on this page were last reviewed by our engineering team in July 2026.