Ultrasonic Machining Quartz Glass – Quartz Glass (CTE 0.59 x 10^-6 /K, 260 nm – 2.5 um); Ultrasonic Machining to +/-0.02 mm form. No minimum order; DFM review included with every RFQ.
Ask any process engineer what makes quartz glass difficult and the answer is specific: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt. Our ultrasonic machining line is tooled around exactly that – 20 kHz ultrasonic spindles with shaped diamond form tools – holding +/-0.02 mm form on parts from 0.5 – 25 mm thick.
Specification envelope
| Material | Quartz Glass (GE214-equivalent, semiconductor grade) |
|---|---|
| Thermal expansion (CTE) | 0.59 x 10^-6 /K |
| Service temperature | 1,050 C continuous |
| Transmission range | 260 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.459 @ 587 nm |
| Stock thickness | 0.20 – 60 mm |
| Maximum blank size | 450 mm diameter |
| Process | Ultrasonic Machining |
| Working tolerance | +/-0.02 mm form |
| Minimum feature | 0.3 mm blind features |
| Surface finish | matte machined surface |
| Thickness window | 0.5 – 25 mm |
| Edge condition | crack-free feature edges |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
What the process holds
Ultrasonic Machining earns its place through blind cavities, non-round holes and stepped profiles that rotary tools cannot reach. Its boundary condition – material removal is slow, so it is reserved for features other processes cannot form – is the first thing our DFM review checks.
Beyond this page, Quartz Glass routinely runs through grinding, edge grinding, dicing, etching in our shop – most real parts combine two or three of these steps.
DFM notes from the shop floor
Three items decide most of the cost and lead time on this work:
- Material note: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
- Process boundary: material removal is slow, so it is reserved for features other processes cannot form.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Where these parts end up
ultrasonic machining quartz glass shows up across semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: ScienceDirect: quartz glass.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Engineers scoping this work usually also review high-purity quartz guide, high-temperature quartz windows, glass hole micromachining.
Common questions
How does Quartz Glass behave under heat?
CTE is 0.59 x 10^-6 /K and continuous service reaches 1,050 C continuous, which is what drives its use where fused from natural quartz crystal matters.
What accuracy does ultrasonic machining hold?
+/-0.02 mm form with minimum features of 0.3 mm blind features. Material removal is slow, so it is reserved for features other processes cannot form.
What equipment runs the ultrasonic machining work?
20 kHz ultrasonic spindles with shaped diamond form tools.
Is there a minimum order for ultrasonic machining quartz glass?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
Specifications on this page were last reviewed by our engineering team in August 2026.