Dicing JGS1 Quartz Glass – JGS1 Quartz Glass (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um (UV grade)); Dicing to +/-0.01 mm index accuracy. No minimum order; DFM review included with every RFQ.
dicing jgs1 quartz glass is a materials problem before it is a machining problem. JGS1 Quartz Glass has deep-uv transmission to 185 nm and a Knoop hardness of 500 kg/mm2, so the dicing recipe – feeds, coolant, tooling – differs from what works on ordinary float glass. The line runs automatic dicing saws with resin and metal-bond blades and holds +/-0.01 mm index accuracy.
Key parameters
| Material | JGS1 Quartz Glass (UV-grade synthetic, bubble class 0) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um (UV grade) |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 30 mm |
| Maximum blank size | 300 mm diameter |
| Process | Dicing |
| Working tolerance | +/-0.01 mm index accuracy |
| Minimum feature | 30 um kerf |
| Surface finish | edge chipping under 15 um |
| Thickness window | 0.05 – 3 mm |
| Edge condition | saw edge, optional etch relief |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
DFM notes from the shop floor
Before sending the RFQ, check these against your drawing:
- Material note: UV-grade surfaces must be polished without subsurface damage that scatters below 250 nm.
- Process boundary: straight-line cuts only; contours route to laser cutting instead.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Process window
Dicing earns its place through singulating wafers into dies with tight index accuracy and low chipping. Its boundary condition – straight-line cuts only; contours route to laser cutting instead – is the first thing our DFM review checks.
Beyond this page, JGS1 Quartz Glass routinely runs through etching, drilling, lapping, coring in our shop – most real parts combine two or three of these steps.
Application context
Orders for dicing jgs1 quartz glass cluster in laser systems (windows, beam splitters, debris shields); aerospace optics (sensor windows, star-tracker flats, radiation-tolerant ports). Background reading on the underlying material science: RP Photonics: fused silica.
Dimensions still moving? Configure this part live in the 3D builder below, or open the full custom glass machining 3D builder to start from a blank canvas.
Useful companion pages: fused silica wafers 2-12 inch, wafer dicing process, optical polishing capability.
Frequently asked questions
What tolerances are achievable on JGS1 Quartz Glass parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. UV-grade surfaces must be polished without subsurface damage that scatters below 250 nm.
What thickness range do you stock for JGS1 Quartz Glass?
Standard stock spans 0.10 – 30 mm, with blanks up to 300 mm diameter. Other formats are sourced per order.
How does JGS1 Quartz Glass behave under heat?
CTE is 0.55 x 10^-6 /K and continuous service reaches 1,100 C continuous, which is what drives its use where deep-UV transmission to 185 nm matters.
What accuracy does dicing hold?
+/-0.01 mm index accuracy with minimum features of 30 um kerf. Straight-line cuts only; contours route to laser cutting instead.
What equipment runs the dicing work?
Automatic dicing saws with resin and metal-bond blades.
Specifications on this page were last reviewed by our engineering team in July 2026.