D263 Thin Glass Glass Wafers for Wafer-Level Packaging: D263 Thin Glass (CTE 7.2 x 10^-6 /K, 350 nm – 2.0 um). Single-piece prototypes to production volumes, quoted from your drawing.
d263 thin glass glass wafers for wafer-level packaging programs need alkali-free thin lids with hermetic-bond edges. D263 Thin Glass is the fit here because it offers down-drawn fire-polished surfaces. Typical parts: cover lids, frit-seal frames, fill-port plates.
Specifications at a glance
| Material | D263 Thin Glass (SCHOTT D 263 T eco) |
|---|---|
| Thermal expansion (CTE) | 7.2 x 10^-6 /K |
| Service temperature | 400 C (Tg 557 C) |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.51 g/cm3 |
| Knoop hardness | 590 kg/mm2 |
| Refractive index | 1.523 @ 587 nm |
| Stock thickness | 0.03 – 1.1 mm |
| Maximum blank size | 440 x 360 mm |
| Wafer formats | 2", 3", 4", 6", 8" and 12" with SEMI flats or notch |
| TTV | under 3 – 5 um by format |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Manufacturing capability
One material, many routes: on D263 Thin Glass we also quote drilling, double-side polishing, laser cutting, grinding, and multi-step drawings are the norm rather than the exception.
DFM notes from the shop floor
Before sending the RFQ, check these against your drawing:
- Material note: ultra-thin stock cannot take conventional clamping; parts are machined on wax or UV-tape carriers.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Typical applications
The recurring buyers of d263 thin glass glass wafers for wafer-level packaging: medical diagnostics (flow cells, slides, microplate bottoms, cuvette windows); led packaging (groove covers, phosphor carriers, package windows); oled packaging (cover lids, frit-seal frames, fill-port plates). Background reading on the underlying material science: SCHOTT D 263 thin glass.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Engineers scoping this work usually also review etched LED/OLED covers, special-shaped glass plates, wafer dicing process.
Common questions
Is there a minimum order for d263 thin glass glass wafers for wafer-level packaging?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on D263 Thin Glass parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Ultra-thin stock cannot take conventional clamping; parts are machined on wax or UV-tape carriers.
Specifications on this page were last reviewed by our engineering team in September 2026.