4 Inch (100 mm) Fused Silica Wafers: Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um); 100 mm format, TTV <3 um. Single-piece prototypes to production volumes, quoted from your drawing.
4 inch (100 mm) fused silica wafers are supplied as finished substrates: edge-rounded, cleaned and packed in wafer cassettes. The material brings near-zero thermal expansion and deep-UV transmission; the format brings SEMI-compatible handling.
Specification envelope
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| Diameter / format | 100 mm |
| Thickness | 0.5 or 0.7 mm standard |
| TTV | <3 um |
| Flat / notch | SEMI standard |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Manufacturing capability
One material, many routes: on Fused Silica we also quote laser cutting, polishing, coring, lapping, and multi-step drawings are the norm rather than the exception.
Design guidance
Three items decide most of the cost and lead time on this work:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Specify flat or notch orientation relative to your device layout – regrinding orientation later scraps the wafer.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Typical applications
The recurring buyers of 4 inch (100 mm) fused silica wafers: microfluidic devices (chips, manifolds, via plates, bonded stacks); laser systems (windows, beam splitters, debris shields); scientific instruments (reference flats, cells, prism mounts, stage inserts). Background reading on the underlying material science: RP Photonics: fused silica.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Related reading on this site: fused silica material guide, CNC machining capability, precision glass grinding.
Common questions
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Fused Silica parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Its hardness and brittleness demand diamond tooling and controlled feeds.
What thickness range do you stock for Fused Silica?
Standard stock spans 0.10 – 50 mm, with blanks up to 450 x 450 mm. Other formats are sourced per order.
How does Fused Silica behave under heat?
CTE is 0.55 x 10^-6 /K and continuous service reaches 1,100 C continuous, which is what drives its use where near-zero thermal expansion matters.
Is there a minimum order for 4 inch (100 mm) fused silica wafers?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
Specifications on this page were last reviewed by our engineering team in October 2026.