Edge Grinding Quartz Glass Wafers: Quartz Glass (CTE 0.59 x 10^-6 /K, 260 nm – 2.5 um); Edge Grinding to chamfer +/-0.05 mm. Single-piece prototypes to production volumes, quoted from your drawing.
We edge-grind Quartz Glass daily, in thicknesses from 0.1 – 25 mm. The controlling numbers: chamfer +/-0.05 mm working tolerance, 0.1 mm chamfer leg minimum features, and ground C or R profile, polish option off the machine. Where the drawing asks for more, downstream lapping and polishing take over.
Specifications at a glance
| Material | Quartz Glass (GE214-equivalent, semiconductor grade) |
|---|---|
| Thermal expansion (CTE) | 0.59 x 10^-6 /K |
| Service temperature | 1,050 C continuous |
| Transmission range | 260 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.459 @ 587 nm |
| Stock thickness | 0.20 – 60 mm |
| Maximum blank size | 450 mm diameter |
| Process | Edge Grinding |
| Working tolerance | chamfer +/-0.05 mm |
| Minimum feature | 0.1 mm chamfer leg |
| Surface finish | ground C or R profile, polish option |
| Thickness window | 0.1 – 25 mm |
| Edge condition | C-chamfer, R-round, pencil or OG profile |
| Wafer formats | 2", 3", 4", 6", 8" and 12" with SEMI flats or notch |
| TTV | under 3 – 5 um by format |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Process window
Edge Grinding earns its place through edge strength – a finished chamfer roughly doubles the bend strength of a cut edge. Its boundary condition – profiles below 0.1 mm leg length are lapped by hand and priced per edge – is the first thing our DFM review checks.
Beyond this page, Quartz Glass routinely runs through double-side polishing, ultrasonic machining, laser cutting, polishing in our shop – most real parts combine two or three of these steps.
DFM notes from the shop floor
Three items decide most of the cost and lead time on this work:
- Material note: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
- Process boundary: profiles below 0.1 mm leg length are lapped by hand and priced per edge.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Who orders this
edge grinding quartz glass wafers shows up across semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: ScienceDirect: quartz glass.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: perforated quartz plates, precision glass grinding, ITO coating process.
Frequently asked questions
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Quartz Glass parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
Specifications on this page were last reviewed by our engineering team in October 2026.