Precision Glass for MEMS Devices: custom precision glass machined to drawing with inspection reports. Single-piece prototypes to production volumes, quoted from your drawing.
precision glass for mems devices programs need anodic-bondable wafers with tight TTV. Typical parts: cap wafers, TGV substrates, motion-sensor lids.
Specification envelope
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
|---|
Getting the drawing right
Three items decide most of the cost and lead time on this work:
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Who orders this
Orders for precision glass for mems devices cluster in microfluidic devices (chips, manifolds, via plates, bonded stacks); laboratory instruments (cuvettes, sight glasses, stir-cell windows); led packaging (groove covers, phosphor carriers, package windows).
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
For adjacent specifications, see glass wafer bonding, glass hole micromachining, optical polishing capability.
Frequently asked questions
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What do mems devices programs usually order?
Cap wafers, TGV substrates, motion-sensor lids. Typical spec: TTV < 3 um, bow < 20 um, SEMI flats.
Is there a minimum order for precision glass for mems devices?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
Specifications on this page were last reviewed by our engineering team in September 2026.