Precision Glass for MEMS Devices: custom precision glass machined to drawing with inspection reports. Single-piece prototypes to production volumes, quoted from your drawing.
precision glass for mems devices programs need anodic-bondable wafers with tight TTV. Typical parts: cap wafers, TGV substrates, motion-sensor lids.
Specification envelope
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
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Specification advice
Before sending the RFQ, check these against your drawing:
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Where these parts end up
The recurring buyers of precision glass for mems devices: laser systems (windows, beam splitters, debris shields); semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); ccd inspection equipment (CCD cover plates, reference grids, stage glass).
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: glass wafer bonding, glass hole micromachining, fused silica wafer applications.
Frequently asked questions
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What do mems devices programs usually order?
Cap wafers, TGV substrates, motion-sensor lids. Typical spec: TTV < 3 um, bow < 20 um, SEMI flats.
Specifications on this page were last reviewed by our engineering team in August 2026.