8 Inch (200 mm) Fused Silica Wafers: Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um); 200 mm format, TTV <4 um. Single-piece prototypes to production volumes, quoted from your drawing.
A wafer is a specification bundle, not just a disc. 8 inch (200 mm) fused silica wafers here mean JGS1 (UV), JGS2 (standard), JGS3 (IR) material with certified CTE of 0.55 x 10^-6 /K, TTV controlled per format, and edges profiled for handler compatibility.
Key parameters
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| Diameter / format | 200 mm |
| Thickness | 0.7 – 1.1 mm |
| TTV | <4 um |
| Flat / notch | SEMI notch |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Specification advice
The shop-floor rules that matter here:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Specify flat or notch orientation relative to your device layout – regrinding orientation later scraps the wafer.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Capabilities and limits
One material, many routes: on Fused Silica we also quote polishing, dicing, cnc machining, lapping, and multi-step drawings are the norm rather than the exception.
Where these parts end up
8 inch (200 mm) fused silica wafers shows up across optical sensors (sensor windows, filter caps, lens covers); mems devices (cap wafers, TGV substrates, motion-sensor lids); ccd inspection equipment (CCD cover plates, reference grids, stage glass). Background reading on the underlying material science: RP Photonics: fused silica.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
For adjacent specifications, see fused silica wafers 2-12 inch, fused silica wafer applications, custom ITO glass.
Common questions
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Fused Silica parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Its hardness and brittleness demand diamond tooling and controlled feeds.
What thickness range do you stock for Fused Silica?
Standard stock spans 0.10 – 50 mm, with blanks up to 450 x 450 mm. Other formats are sourced per order.
How does Fused Silica behave under heat?
CTE is 0.55 x 10^-6 /K and continuous service reaches 1,100 C continuous, which is what drives its use where near-zero thermal expansion matters.
Specifications on this page were last reviewed by our engineering team in October 2026.