Borofloat 33 for LED Packaging

Borofloat 33 for LED Packaging: Borofloat 33, CTE 3.25 x 10^-6 /K. No MOQ, prototypes in 5-10 days, DFM review with every RFQ.

Industry Application July 29, 2026

Quick answer: Borofloat 33 for LED Packaging covers Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um). Prototypes ship in 5-10 working days.

What borofloat 33 for led packaging actually buys from a glass shop: groove covers, phosphor carriers, package windows. The requirement underneath is diced covers with etched cavities and printed dams. Borofloat 33 is the fit here because it offers float-glass flatness off the line.

Key parameters

Material Borofloat 33 (SCHOTT float production, wafer grade)
Thermal expansion (CTE) 3.25 x 10^-6 /K
Service temperature 450 C continuous
Transmission range 350 nm – 2.0 um
Density 2.23 g/cm3
Knoop hardness 480 kg/mm2
Refractive index 1.471 @ 587 nm
Stock thickness 0.70 – 25.4 mm
Maximum blank size 500 x 500 mm
RFQ inputs PDF/DXF/STEP drawing, quantity brackets, surface and edge spec

Specification advice

Before sending the RFQ, check these against your drawing:

  • Material note: float tin side must be tracked when parts see coating or bonding steps.
  • Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.

For the complete framework, see the tolerance design guide and the holes and edges design guide.

Capabilities and limits

One material, many routes: on Borofloat 33 we also quote double-side polishing, dicing, lapping, etching, and multi-step drawings are the norm rather than the exception.

Typical applications

The recurring buyers of borofloat 33 for led packaging: optical sensors (sensor windows, filter caps, lens covers); microfluidic devices (chips, manifolds, via plates, bonded stacks); mems devices (cap wafers, TGV substrates, motion-sensor lids). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.

Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.

For adjacent specifications, see etched LED/OLED covers, Borofloat 33 selection guide, glass sandblasting.

Common questions

How does Borofloat 33 behave under heat?

CTE is 3.25 x 10^-6 /K and continuous service reaches 450 C continuous, which is what drives its use where float-glass flatness off the line matters.

What do led packaging programs usually order?

Groove covers, phosphor carriers, package windows. Typical spec: dice to +/-0.02 mm, cavity depth +/-5 um.

Is there a minimum order for borofloat 33 for led packaging?

No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.

How fast can prototypes ship?

Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.

What files do you need for a quote?

A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.

Specifications on this page were last reviewed by our engineering team in August 2026.

Configure in 3D, draw in 2D

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FREQUENTLY ASKED QUESTIONS
What machined features can be added to cover glass?

Edge grooves, a center cavity or an edge step for module packaging, each with adjustable width and depth. Functional coatings such as AR, anti-fingerprint, ITO or a black border print are also available.

Which edge finishes are supported?

As-cut, ground, polished or C-chamfer. The preview color-codes the edge and shows a double line for a C-chamfer.

Need a different product family? Open the full 3D + 2D builder.

Engineering Review

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