Double-Side Polishing Quartz Glass Wafers: Quartz Glass (CTE 0.59 x 10^-6 /K, 260 nm – 2.5 um); Double-Side Polishing to TTV under 3 um. Single-piece prototypes to production volumes, quoted from your drawing.
double-side polishing quartz glass wafers is a materials problem before it is a machining problem. Quartz Glass has fused from natural quartz crystal and a Knoop hardness of 500 kg/mm2, so the double-side polishing recipe – feeds, coolant, tooling – differs from what works on ordinary float glass. The line runs planetary double-side polishers with carrier plates and holds TTV under 3 um.
Key parameters
| Material | Quartz Glass (GE214-equivalent, semiconductor grade) |
|---|---|
| Thermal expansion (CTE) | 0.59 x 10^-6 /K |
| Service temperature | 1,050 C continuous |
| Transmission range | 260 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.459 @ 587 nm |
| Stock thickness | 0.20 – 60 mm |
| Maximum blank size | 450 mm diameter |
| Process | Double-Side Polishing |
| Working tolerance | TTV under 3 um |
| Minimum feature | Ra below 0.5 nm both faces |
| Surface finish | 60/40 to 20/10 both faces |
| Thickness window | 0.1 – 10 mm |
| Edge condition | edge-rounded before DSP |
| Wafer formats | 2", 3", 4", 6", 8" and 12" with SEMI flats or notch |
| TTV | under 3 – 5 um by format |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Specification advice
Three items decide most of the cost and lead time on this work:
- Material note: natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
- Process boundary: parts must be round or near-round; strongly asymmetric outlines wedge in the carriers.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Manufacturing capability
The core strength of Double-Side Polishing is wafer-grade parallelism and sub-nanometer roughness on both faces simultaneously. The honest limit: parts must be round or near-round; strongly asymmetric outlines wedge in the carriers. Both belong on the drawing before quoting, not after.
One material, many routes: on Quartz Glass we also quote laser cutting, coring, ultrasonic machining, sandblasting, and multi-step drawings are the norm rather than the exception.
Application context
double-side polishing quartz glass wafers shows up across semiconductor equipment (view ports, wafer carriers, plasma rings, chamber windows); laboratory instruments (cuvettes, sight glasses, stir-cell windows). Background reading on the underlying material science: ScienceDirect: quartz glass.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
For adjacent specifications, see high-temperature quartz windows, ultra-thin quartz discs, surface quality guide.
Buyer questions, answered
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Quartz Glass parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Natural-quartz batches vary in metallic ppm, so semiconductor lots need certs per melt.
What thickness range do you stock for Quartz Glass?
Standard stock spans 0.20 – 60 mm, with blanks up to 450 mm diameter. Other formats are sourced per order.
Specifications on this page were last reviewed by our engineering team in October 2026.