Fused Silica Glass Wafers for Microfluidics – Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um). No minimum order; DFM review included with every RFQ.
What fused silica glass wafers for microfluidics actually buys from a glass shop: chips, manifolds, via plates, bonded stacks. The requirement underneath is optically clear, low-autofluorescence channel plates. Fused Silica is the fit here because it offers near-zero thermal expansion.
The numbers
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| Wafer formats | 2", 3", 4", 6", 8" and 12" with SEMI flats or notch |
| TTV | under 3 – 5 um by format |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Specification advice
Before sending the RFQ, check these against your drawing:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Process window
Beyond this page, Fused Silica routinely runs through coring, drilling, lapping, etching in our shop – most real parts combine two or three of these steps.
Application context
Orders for fused silica glass wafers for microfluidics cluster in mems devices (cap wafers, TGV substrates, motion-sensor lids); ccd inspection equipment (CCD cover plates, reference grids, stage glass); optical sensors (sensor windows, filter caps, lens covers). Background reading on the underlying material science: RP Photonics: fused silica.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
For adjacent specifications, see glass wafer bonding, wafer dicing process, glass wafer coring.
Frequently asked questions
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Fused Silica parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Its hardness and brittleness demand diamond tooling and controlled feeds.
What thickness range do you stock for Fused Silica?
Standard stock spans 0.10 – 50 mm, with blanks up to 450 x 450 mm. Other formats are sourced per order.
How does Fused Silica behave under heat?
CTE is 0.55 x 10^-6 /K and continuous service reaches 1,100 C continuous, which is what drives its use where near-zero thermal expansion matters.
Specifications on this page were last reviewed by our engineering team in October 2026.