Laser Cutting Fused Silica Wafers – Fused Silica (CTE 0.55 x 10^-6 /K, 185 nm – 2.5 um); Laser Cutting to +/-0.02 mm contour. No minimum order; DFM review included with every RFQ.
laser cutting fused silica wafers is a materials problem before it is a machining problem. Fused Silica has near-zero thermal expansion and a Knoop hardness of 500 kg/mm2, so the laser cutting recipe – feeds, coolant, tooling – differs from what works on ordinary float glass. The line runs picosecond and CO2 laser stations with vision registration and holds +/-0.02 mm contour.
Key parameters
| Material | Fused Silica (JGS1 (UV), JGS2 (standard), JGS3 (IR)) |
|---|---|
| Thermal expansion (CTE) | 0.55 x 10^-6 /K |
| Service temperature | 1,100 C continuous |
| Transmission range | 185 nm – 2.5 um |
| Density | 2.20 g/cm3 |
| Knoop hardness | 500 kg/mm2 |
| Refractive index | 1.458 @ 587 nm |
| Stock thickness | 0.10 – 50 mm |
| Maximum blank size | 450 x 450 mm |
| Process | Laser Cutting |
| Working tolerance | +/-0.02 mm contour |
| Minimum feature | 0.10 mm hole diameter |
| Surface finish | sealed edge, chip-free |
| Thickness window | 0.03 – 6 mm |
| Edge condition | filamentation edge, optional post-polish |
| Wafer formats | 2", 3", 4", 6", 8" and 12" with SEMI flats or notch |
| TTV | under 3 – 5 um by format |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Design guidance
The shop-floor rules that matter here:
- Material note: its hardness and brittleness demand diamond tooling and controlled feeds.
- Process boundary: aspect ratio in a single pass tops out near 10:1; thicker sections shift to coring or ultrasonic work.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Manufacturing capability
The core strength of Laser Cutting is chip-free free-form contours and dense hole arrays in thin and ultra-thin glass. The honest limit: aspect ratio in a single pass tops out near 10:1; thicker sections shift to coring or ultrasonic work. Both belong on the drawing before quoting, not after.
One material, many routes: on Fused Silica we also quote edge grinding, ultrasonic machining, coring, etching, and multi-step drawings are the norm rather than the exception.
Where these parts end up
The recurring buyers of laser cutting fused silica wafers: laboratory instruments (cuvettes, sight glasses, stir-cell windows); machine vision (camera windows, ring-light diffusers, calibration plates); optical sensors (sensor windows, filter caps, lens covers). Background reading on the underlying material science: RP Photonics: fused silica.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: fused silica wafer applications, fused silica wafers 2-12 inch, FTO conductive glass.
Common questions
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Do parts ship with inspection data?
Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.
What tolerances are achievable on Fused Silica parts?
Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Its hardness and brittleness demand diamond tooling and controlled feeds.
Specifications on this page were last reviewed by our engineering team in October 2026.