Borofloat 33 Glass Wafers for Microfluidics – Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um). No minimum order; DFM review included with every RFQ.
borofloat 33 glass wafers for microfluidics programs need optically clear, low-autofluorescence channel plates. Borofloat 33 is the fit here because it offers float-glass flatness off the line. Typical parts: chips, manifolds, via plates, bonded stacks.
Specifications at a glance
| Material | Borofloat 33 (SCHOTT float production, wafer grade) |
|---|---|
| Thermal expansion (CTE) | 3.25 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.471 @ 587 nm |
| Stock thickness | 0.70 – 25.4 mm |
| Maximum blank size | 500 x 500 mm |
| Wafer formats | 2", 3", 4", 6", 8" and 12" with SEMI flats or notch |
| TTV | under 3 – 5 um by format |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Manufacturing capability
One material, many routes: on Borofloat 33 we also quote polishing, coring, lapping, dicing, and multi-step drawings are the norm rather than the exception.
DFM notes from the shop floor
Before sending the RFQ, check these against your drawing:
- Material note: float tin side must be tracked when parts see coating or bonding steps.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Typical applications
The recurring buyers of borofloat 33 glass wafers for microfluidics: led packaging (groove covers, phosphor carriers, package windows); mems devices (cap wafers, TGV substrates, motion-sensor lids); microfluidic devices (chips, manifolds, via plates, bonded stacks). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Related reading on this site: 4 inch Borofloat wafers, glass wafer bonding, JGS1 quartz glass.
Frequently asked questions
How does Borofloat 33 behave under heat?
CTE is 3.25 x 10^-6 /K and continuous service reaches 450 C continuous, which is what drives its use where float-glass flatness off the line matters.
What do microfluidic devices programs usually order?
Chips, manifolds, via plates, bonded stacks. Typical spec: channels from 10 um, bond voids < 1%.
Is there a minimum order for borofloat 33 glass wafers for microfluidics?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Specifications on this page were last reviewed by our engineering team in August 2026.