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Borofloat 33 With Microchannels

Borofloat 33 With Microchannels: Borofloat 33, CTE 3.25 x 10^-6 /K. No MOQ, prototypes in 5-10 days, DFM review with every RFQ.

Borofloat 33 With Microchannels

Borofloat 33 With Microchannels: Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); width from 10 um etched, 100 um machined. Single-piece prototypes to production volumes, quoted from your drawing.

Buyers come to borofloat 33 with microchannels with two kinds of parts: catalog-adjacent blanks that need accurate finishing, and genuinely custom geometry. We quote both from the same dataset – SCHOTT float production, wafer grade stock in 0.70 – 25.4 mm, blanks to 500 x 500 mm.

The numbers

Material Borofloat 33 (SCHOTT float production, wafer grade)
Thermal expansion (CTE) 3.25 x 10^-6 /K
Service temperature 450 C continuous
Transmission range 350 nm – 2.0 um
Density 2.23 g/cm3
Knoop hardness 480 kg/mm2
Refractive index 1.471 @ 587 nm
Stock thickness 0.70 – 25.4 mm
Maximum blank size 500 x 500 mm
Feature Microchannels
Capability width from 10 um etched, 100 um machined
RFQ inputs PDF/DXF/STEP drawing, quantity brackets, surface and edge spec

Getting the drawing right

The shop-floor rules that matter here:

  • Material note: float tin side must be tracked when parts see coating or bonding steps.
  • Feature rule: isotropic etch widens channels ~2x depth – masks are compensated.
  • Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.

For the complete framework, see the tolerance design guide and the holes and edges design guide.

Manufacturing capability

One material, many routes: on Borofloat 33 we also quote grinding, laser cutting, lapping, coring, and multi-step drawings are the norm rather than the exception.

These features are produced by etching or laser cutting. Capability: width from 10 um etched, 100 um machined. Design rule worth copying onto the drawing: isotropic etch widens channels ~2x depth – masks are compensated.

Application context

borofloat 33 with microchannels shows up across microfluidic devices (chips, manifolds, via plates, bonded stacks); led packaging (groove covers, phosphor carriers, package windows); machine vision (camera windows, ring-light diffusers, calibration plates). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.

Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.

For adjacent specifications, see wafer dicing process, 4 inch Borofloat wafers, AR optical windows.

Frequently asked questions

Is there a minimum order for borofloat 33 with microchannels?

No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.

How fast can prototypes ship?

Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.

What files do you need for a quote?

A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.

Do parts ship with inspection data?

Dimensional reports, surface certificates and material certs per melt are available; specify the level on the RFQ.

What tolerances are achievable on Borofloat 33 parts?

Ground features hold +/-0.01 mm and lapped thickness reaches +/-0.003 mm. Float tin side must be tracked when parts see coating or bonding steps.

Specifications on this page were last reviewed by our engineering team in September 2026.

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FREQUENTLY ASKED QUESTIONS
What channel features and materials can I specify?

Channel width and depth, ports and chambers, in materials such as Borofloat 33, fused silica or quartz, with thermal or anodic bonding for a sealed device.

Need a different product family? Open the full 3D + 2D builder.

Engineering Review

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