Borofloat 33 With Microchannels: Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); width from 10 um etched, 100 um machined. Single-piece prototypes to production volumes, quoted from your drawing.
Buyers come to borofloat 33 with microchannels with two kinds of parts: catalog-adjacent blanks that need accurate finishing, and genuinely custom geometry. We quote both from the same dataset – SCHOTT float production, wafer grade stock in 0.70 – 25.4 mm, blanks to 500 x 500 mm.
The numbers
| Material | Borofloat 33 (SCHOTT float production, wafer grade) |
|---|---|
| Thermal expansion (CTE) | 3.25 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.471 @ 587 nm |
| Stock thickness | 0.70 – 25.4 mm |
| Maximum blank size | 500 x 500 mm |
| Feature | Microchannels |
| Capability | width from 10 um etched, 100 um machined |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Specification advice
Before sending the RFQ, check these against your drawing:
- Material note: float tin side must be tracked when parts see coating or bonding steps.
- Feature rule: isotropic etch widens channels ~2x depth – masks are compensated.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
For the complete framework, see the tolerance design guide and the holes and edges design guide.
Capabilities and limits
One material, many routes: on Borofloat 33 we also quote laser cutting, etching, cnc machining, double-side polishing, and multi-step drawings are the norm rather than the exception.
These features are produced by etching or laser cutting. Capability: width from 10 um etched, 100 um machined. Design rule worth copying onto the drawing: isotropic etch widens channels ~2x depth – masks are compensated.
Typical applications
Orders for borofloat 33 with microchannels cluster in mems devices (cap wafers, TGV substrates, motion-sensor lids); optical sensors (sensor windows, filter caps, lens covers); microfluidic devices (chips, manifolds, via plates, bonded stacks). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.
Dimensions still moving? Configure this part live in the 3D + 2D builder below, or open the full custom glass machining 3D + 2D builder to start from a blank canvas.
Useful companion pages: Borofloat 33 selection guide, 4 inch Borofloat wafers, custom ITO glass.
Frequently asked questions
How does Borofloat 33 behave under heat?
CTE is 3.25 x 10^-6 /K and continuous service reaches 450 C continuous, which is what drives its use where float-glass flatness off the line matters.
What is the design rule for microchannels?
Isotropic etch widens channels ~2x depth – masks are compensated.
Is there a minimum order for borofloat 33 with microchannels?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
What files do you need for a quote?
A dimensioned PDF plus DXF or STEP geometry. If only a sketch exists, our drawing review service formalizes it before quoting.
Specifications on this page were last reviewed by our engineering team in August 2026.