Borofloat 33 With Through Holes – Borofloat 33 (CTE 3.25 x 10^-6 /K, 350 nm – 2.0 um); 0.15 – 100 mm diameter through plates to 40 mm. No minimum order; DFM review included with every RFQ.
Our borofloat 33 with through holes cover the full route from blank to inspected part: sawing, CNC profiling, drilling, grinding, polishing and edge finishing under one roof. Borofloat 33 stands out for float-glass flatness off the line and anodic bonding to silicon, and both properties survive our processing because every step is tuned to the material.
Specifications at a glance
| Material | Borofloat 33 (SCHOTT float production, wafer grade) |
|---|---|
| Thermal expansion (CTE) | 3.25 x 10^-6 /K |
| Service temperature | 450 C continuous |
| Transmission range | 350 nm – 2.0 um |
| Density | 2.23 g/cm3 |
| Knoop hardness | 480 kg/mm2 |
| Refractive index | 1.471 @ 587 nm |
| Stock thickness | 0.70 – 25.4 mm |
| Maximum blank size | 500 x 500 mm |
| Feature | Through Holes |
| Capability | 0.15 – 100 mm diameter through plates to 40 mm |
| RFQ inputs | PDF/DXF/STEP drawing, quantity brackets, surface and edge spec |
Capabilities and limits
One material, many routes: on Borofloat 33 we also quote coring, dicing, edge grinding, polishing, and multi-step drawings are the norm rather than the exception.
These features are produced by drilling or coring. Capability: 0.15 – 100 mm diameter through plates to 40 mm. Design rule worth copying onto the drawing: exit-side chipping held under 0.1 mm with backing.
Design guidance
The shop-floor rules that matter here:
- Material note: float tin side must be tracked when parts see coating or bonding steps.
- Feature rule: exit-side chipping held under 0.1 mm with backing.
- Over-specification is the quiet budget killer: a 20/10 scratch-dig face costs roughly three times an 80/50 face, so grade each surface individually.
The full rules live in our tolerance design guide and holes and edges design guide.
Who orders this
Orders for borofloat 33 with through holes cluster in mems devices (cap wafers, TGV substrates, motion-sensor lids); microfluidic devices (chips, manifolds, via plates, bonded stacks); optical sensors (sensor windows, filter caps, lens covers). Background reading on the underlying material science: SCHOTT BOROFLOAT product page.
The fastest route to a quote is geometry: use the 3D builder below, draw a dimensioned 2D drawing from it, or open the site-wide custom glass machining 3D + 2D builder for fully custom parts.
Related reading on this site: wafer dicing process, Borofloat 33 selection guide, material selection guide.
Common questions
How does Borofloat 33 behave under heat?
CTE is 3.25 x 10^-6 /K and continuous service reaches 450 C continuous, which is what drives its use where float-glass flatness off the line matters.
What is the design rule for through holes?
Exit-side chipping held under 0.1 mm with backing.
Is there a minimum order for borofloat 33 with through holes?
No. Single prototypes are accepted, and pricing steps down at 10, 100 and 1,000 pieces.
How fast can prototypes ship?
Machined prototypes ship in 5 – 10 working days. Coated or bonded parts add 1 – 2 weeks depending on queue slots.
Specifications on this page were last reviewed by our engineering team in August 2026.